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    About Us

Company Profile

Motorcomm Electronic Technology Co., Ltd. ("Motorcomm"), founded in 2017, has set up R&D centers in Suzhou High-tech Zone and Shanghai Zhangjiang Science City, and companies in Shanghai, Chengdu and Shenzhen, aiming at realizing the industrialization of full coverage services. Adhering to the culture of "Efficiency First, Pursuit of Excellence", Motorcomm focuses on the R&D, design and sale of high-speed wired communication chips.Motorcomm has been implementing the "market-oriented and technology-driven" development strategy, and aims to offer the market high-reliability and high-stability communication chip products. We're taking the Ethernet Physical Layer (PHY) chip as the approach to the market, and continue to unveil series of chip products. Motorcomm is one of the few suppliers of Ethernet PHY chips with independent intellectual property rights and volume sales in the Chinese Mainland. Motorcomm will focus on enhancing our capability to innovate, research and develop core technologies, continuously enhancing the competitive advantages of our Ethernet series products in the market, and finding our correct location in the era of technological innovation.

Nanjing
Nanjing
Shanghai
Motorcomm Eastern Branch
Shanghai R&D Center
Chengdu
Motorcomm Southwest Branch
Shenzhen
Motorcomm Southern Branch
Suzhou
Motorcomm Headquarters
Suzhou Development Center
branch
R&D center

Drawing review #: GS(2016)1663

Supervised by the Ministry of Natural Resources of the People's Republic of China

Development Paths

  • 2017

    Start-up brand Established, taped out the first test chip and launched the first automotive system

  • 2018

    Budding Successfully developed the first chip; reached the first round of strategic cooperation

  • 2019

    Following the trend A variety of chips MPed, strategic cooperation with a number of well-known enterprises

  • 2020

    Overcoming turbulent times Grew rapidly, achieved C&S international certification for automotive chips, and initially formed the series of Ethernet PHY products

  • 2021

    Technological innovation Passed AEC-Q100 Grad1 certification, and achieved zero breakthroughs in domestic related technologies

  • 2022

    Successful listing Launched new Ethernet product lines, became the fastest company with successful IPO filings on the Sci-Tech Innovation Board in 2022

  • 2023

    Scale development On February 10, 2023, was officially listed on the Sci-Tech Innovation Board, continue to increase investment in R&D

2017

2018

2019

2020

2021

2022

2023

  • Certifications
  • Patents
  • ISO 9001 Certification
  • AEC-Q100 GRADE1 Qualification
  • OPEN Alliance's Interoperability Certification (C&S International Certification)
  • SGS ISO 26262:2018 (Automotive Electronic Functional Safety Certification)
  • High-tech Enterprise Certificate
  • EMC Test Report
  • 76 invention patents filed (18 granted)
  • 18 utility model patents filed (12 granted)
  • 31 IC layout designs granted