Company Profile
Motorcomm Electronic Technology Co., Ltd. ("Motorcomm"), founded in 2017, has set up R&D centers in Suzhou High-tech Zone and Shanghai Zhangjiang Science City, and companies in Shanghai, Chengdu and Shenzhen, aiming at realizing the industrialization of full coverage services. Adhering to the culture of "Efficiency First, Pursuit of Excellence", Motorcomm focuses on the R&D, design and sale of high-speed wired communication chips.Motorcomm has been implementing the "market-oriented and technology-driven" development strategy, and aims to offer the market high-reliability and high-stability communication chip products. We're taking the Ethernet Physical Layer (PHY) chip as the approach to the market, and continue to unveil series of chip products. Motorcomm is one of the few suppliers of Ethernet PHY chips with independent intellectual property rights and volume sales in the Chinese Mainland. Motorcomm will focus on enhancing our capability to innovate, research and develop core technologies, continuously enhancing the competitive advantages of our Ethernet series products in the market, and finding our correct location in the era of technological innovation.
Shanghai R&D Center
Suzhou Development Center
Drawing review #: GS(2016)1663
Supervised by the Ministry of Natural Resources of the People's Republic of China
Development Paths
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2017
Start-up brand Established, taped out the first test chip and launched the first automotive system
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2018
Budding Successfully developed the first chip; reached the first round of strategic cooperation
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2019
Following the trend A variety of chips MPed, strategic cooperation with a number of well-known enterprises
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2020
Overcoming turbulent times Grew rapidly, achieved C&S international certification for automotive chips, and initially formed the series of Ethernet PHY products
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2021
Technological innovation Passed AEC-Q100 Grad1 certification, and achieved zero breakthroughs in domestic related technologies
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2022
Successful listing Launched new Ethernet product lines, became the fastest company with successful IPO filings on the Sci-Tech Innovation Board in 2022
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2023
Scale development On February 10, 2023, was officially listed on the Sci-Tech Innovation Board, continue to increase investment in R&D
2017
2018
2019
2020
2021
2022
2023
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Certifications
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Patents
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ISO 9001 Certification
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AEC-Q100 GRADE1 Qualification
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OPEN Alliance's Interoperability Certification (C&S International Certification)
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SGS ISO 26262:2018 (Automotive Electronic Functional Safety Certification)
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High-tech Enterprise Certificate
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EMC Test Report
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76 invention patents filed (18 granted)
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18 utility model patents filed (12 granted)
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31 IC layout designs granted